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Winmate IQ30 3.5” SBC with Qualcomm Snapdragon™ 660 octa-core processor

- 3.5" Form Factor (146 mm x 102 mm) - Qualcomm Snapdragon™ 660 octa-core, 2.2 GHz CPU - Integrated LVDS, eDP (Optional) - 3GB LPDDR4 (Optional 4GB), 32GB eMMC - Rear IO Supports 1 x COM, 2 x USB 2.0, 1 x USB Type C,1 x LAN ,1 x SD slot

System Specification  
Form Factor
3.5"
Processor Qualcomm Snapdragon™ 660 octa-core, 2.2 GHz CPU
System Memory 3GB LPDDR4 (Optional 4GB)
Graphic Interface 1 x EDP (MIPI to EDP)
1 x LVDS (MIPI to LVDS)
Storage 32GB MLC
I/O Connectors
 
Back Side I/O
2 x USB 2.0 Type A
1 x Terminal Block(Optional for 12V DC Jack)
1 x Micro SD Card Slot
1 x Micro SIM Card Slot
1 x USB Type-C
1 x LAN(USB to LAN AX8817A)(Optional for PoE at/af)
1 x RS232/422/485(Full COM)
Internal I/O pin-header 2 x Light BAR / 1x4-pin with UART
2 x Backlight wafer(5V/3.3V)
1 x LVDS (DF13/FPC)
1 x EDP (15 Pin Waffer)
1 x SW1 (SW Burning Switch)
2 x DMIC (4 Pin Waffer/Per)
2 x USB 2.0 Touch (FFC Connector)
1 x GPIO for 5 key OSD (6 Pin Waffer)
1 x GPIO For Membrane (2x5 Waffer)
1 x Analog MIC (2 Pin Waffer)
2 x Speaker (L/R, 2 Pin Waffer)
1 x 14 Pin DIDO (6 DI, 6 DO, GND, 5V)
1 x 4 Pin Waffer CANBus With Isolation (CANH, CANL,
5V)
1 x 10 Pin COM Port (Full COM RS232, 5V)
3 x USB 2.0 (2x4 Waffer/per)
1 x RTC Battery
1 x Debug Port (6 Pin Waffer)
1 x 5V output (2 Pin Waffer)
1x 3.3V output (2 Pin Waffer)
1 x UART (TX, RX, 3.3V, GND)
1 x M.2 (PCIe Signal With USB)
1 x NFC (NQ310A)
3 x ANT (Wi-Fi, BT, NFC)
Power input 12V DC-in Power Jack
Audio Specification
 
Audio Interface
Speaker, Line Out, MIC
Codec PM660L
Mechanical & Environment Specification
Dimensions ( L x W )
3.5" Form Factor (146 mm x 102 mm)
Operating Temperature -20 deg. C to 60 deg. C
Operating Humidity 10% to 95% (non-condensing, RH)
Power consumption 3W
Storage Temperature -40 deg. C to 70 deg. C
RF
 
WLAN
Wi-Fi a/b/g/n/ac
BT BT 5

  • - SKU: IQ30 3.5” SBC with Qualcomm Snapdragon™ 660 octa-core processor
  • - Weight: 0
  • - Brand: Winmate
Categories :
System Specification  
Form Factor
3.5"
Processor Qualcomm Snapdragon™ 660 octa-core, 2.2 GHz CPU
System Memory 3GB LPDDR4 (Optional 4GB)
Graphic Interface 1 x EDP (MIPI to EDP)
1 x LVDS (MIPI to LVDS)
Storage 32GB MLC
I/O Connectors
 
Back Side I/O
2 x USB 2.0 Type A
1 x Terminal Block(Optional for 12V DC Jack)
1 x Micro SD Card Slot
1 x Micro SIM Card Slot
1 x USB Type-C
1 x LAN(USB to LAN AX8817A)(Optional for PoE at/af)
1 x RS232/422/485(Full COM)
Internal I/O pin-header 2 x Light BAR / 1x4-pin with UART
2 x Backlight wafer(5V/3.3V)
1 x LVDS (DF13/FPC)
1 x EDP (15 Pin Waffer)
1 x SW1 (SW Burning Switch)
2 x DMIC (4 Pin Waffer/Per)
2 x USB 2.0 Touch (FFC Connector)
1 x GPIO for 5 key OSD (6 Pin Waffer)
1 x GPIO For Membrane (2x5 Waffer)
1 x Analog MIC (2 Pin Waffer)
2 x Speaker (L/R, 2 Pin Waffer)
1 x 14 Pin DIDO (6 DI, 6 DO, GND, 5V)
1 x 4 Pin Waffer CANBus With Isolation (CANH, CANL,
5V)
1 x 10 Pin COM Port (Full COM RS232, 5V)
3 x USB 2.0 (2x4 Waffer/per)
1 x RTC Battery
1 x Debug Port (6 Pin Waffer)
1 x 5V output (2 Pin Waffer)
1x 3.3V output (2 Pin Waffer)
1 x UART (TX, RX, 3.3V, GND)
1 x M.2 (PCIe Signal With USB)
1 x NFC (NQ310A)
3 x ANT (Wi-Fi, BT, NFC)
Power input 12V DC-in Power Jack
Audio Specification
 
Audio Interface
Speaker, Line Out, MIC
Codec PM660L
Mechanical & Environment Specification
Dimensions ( L x W )
3.5" Form Factor (146 mm x 102 mm)
Operating Temperature -20 deg. C to 60 deg. C
Operating Humidity 10% to 95% (non-condensing, RH)
Power consumption 3W
Storage Temperature -40 deg. C to 70 deg. C
RF
 
WLAN
Wi-Fi a/b/g/n/ac
BT BT 5
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